Technical advantages：Microwave plasma cleaning has very outstanding advantages, such as high cleaning efficiency, no damage to the semiconductor components or secondary contamination, and the ability to thoroughly clean and treat contaminants on the material surface. It is especially suitable for sensitive chip package cleaning.

Product overview：

• Full-Featured Design in Rack Style

• Suitable for Batch Production

• PLC Control System with GUI Touch Screen

Applications: Removal of organic containment, polymer activation, metal deoxidation, PR descum, polymerization coating.

Features:

Non-damage plasma clean

Effectively clean small holes and internal surface

Strong deoxidation ablity

Low process temperature